Advertisements

University Of Dayton – International Merit Scholarship In USA 2020-2021

International Merit Scholarship

Scholarship Description:

University of Dayton – International Merit Scholarship in USA is open for International Students irrespective of their nationality. The scholarship allows Undergraduate level programm(s) in the field of Business Administration, Engineering, Arts, Education, Health Sciences taught at University of Dayton. The deadline to apply for the international merit scholarship is 01 Nov 2020.

Degree Level:

University of Dayton – International Merit Scholarship in USA is available to undertake Undergraduate level programs at the University of Dayton .

Subjects Available:

Following subject are available to study under the university of Dayton international merit scholarship program.

  • Business Administration
  • Engineering
  • Arts
  • Education
  • Health Sciences

Eligible Nationalities:

International students irrespective of their nationality are eligible for the university of Dayton international merit scholarship program.

Scholarship Benefits:

The funding programme will provide the award amount of up to $105,390 over four years for eligible candidates. The scholarship is not on full but partial funding.

Eligibility Criteria:

To be eligible, the applicants must have a minimum 3.0 cumulative GPA across all schools attended. To earn it, you have to work for it. You can click on the link below for more valid information about the scholarship, how to apply and if the course you want to study has other requirements aside the general requirements so as to prepare adequately. you can also ask question and help on how to go about the application.

Application Procedure:

To apply for this opportunity, aspirants need to apply for admission to an undergraduate degree program at the university of Dayton. Thereafter, they will automatically be considered for a merit scholarship when you apply for admission.

Advertisements

Similar Posts

Leave a Reply

Your email address will not be published. Required fields are marked *